TYVS Series
It is an insulated heat dissipation with low molecular siloxane that may cause contact failure reduced to a certain level,
recommended for electrical / electronic applications.
recommended for electrical / electronic applications.
TYVS Series
It is an insulated heat dissipation with low molecular siloxane that may cause contact failure reduced to a certain level,
recommended for electrical / electronic applications.
Thermal Pad (TYVS Series)
* Low molecular siloxane
- Non-reactive cyclic dimethylpolysiloxane
- In general, it is of a structure where 3 (D3) to 10 (D10) monomers are combined.
- It is also derived from the silicone resin and exists as a small amount of an annular body in the product, which provides for the cause of contact failure.
Specification
TYVS Series | Test Method | TYVS – 15 | TYVS – 30 |
Appearance / Color | – | Green | Sky blue |
Thickness [㎜] | ASTM D374 | 0.5 ~ 5 | 0.5 ~ 5 |
Density [g/㎤] | ASTM D792 | 2.7 | 2.9 |
Thermal Conductivity [W/m·k] | ASTM D5470 | 1.5 | 3.0 |
Hardness [Shore 00] | ASTM D2240 | 55 | 55 |
Breakdown Voltage [㎸/㎜] | ASTM D149 | > 10 | > 10 |
Volume Resistivity [Ω·㎝] | ASTM D257 | 1012 | 1012 |
Flammability | UL94 | V-0 | V-0 |
Content of Low Molecular Siloxane (ΣD3-D9) [ppm] | – | < 70 | < 70 |
Recommended Application
Semiconductor equipment
LED Light
Battery Pack
EPCU